Via heat sink material
US7124931B2 · kind B2 · utility
5Cited by
9References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2003 |
| Grant date | Oct 24, 2006 |
| Priority date | — |
| Expiry date | Jun 7, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention provides thermally conductive material so that less heat traveling from one side of a layer will reach connection material on another side of a layer. Rather, some of the heat will be conducted away by the thermally conductive material and dissipated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.