Multi-platen multi-slurry chemical mechanical polishing process
US7125321B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2004 |
| Grant date | Oct 24, 2006 |
| Priority date | — |
| Expiry date | Dec 17, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/042
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A multi-platen, multi-slurry chemical mechanical polishing method comprises providing a substrate having a surface that includes at least one nitride structure and an oxide layer atop the nitride structure, performing a first CMP process on the substrate using a first platen with a silica based slurry to remove a bulk portion of the oxide layer without exposing the nitride structure, performing a second CMP process on the substrate using a second platen with a ceria based slurry to remove a residual portion of the oxide layer and to expose at least a portion of the nitride structure, and performing a third CMP process on the substrate using the first platen with a silica based slurry to remove at least one defect caused by the ceria based slurry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.