Method for bump exposing relief image printing plates
US7125650B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Jul 20, 2004 |
| Grant date | Oct 24, 2006 |
| Priority date | — |
| Expiry date | Jul 20, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/146
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A process of producing a relief image printing plate, the process comprising the steps of providing a photosensitive printing element, quenching dissolved oxygen in the photosensitive resin layer by pre-exposing the photosensitive layer to one or more sources of actinic radiation, wherein the range of wavelengths spanned by the one or more sources of actinic radiation differs by no more than about 20 nm, and imagewise exposing the photosensitive resin layer to actinic radiation to crosslink and cure the photosensitive resin layer. The photosensitive composition typically comprises at least one photoinitiator that is present in the photosensitive composition in an amount sufficient to provide an optical density in the photosensitive composition of between about 0.05 and 0.43 at a wavelength used to pre-expose the photosensitive composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.