Method for opening the plastic housing of an electronic module

US7125729B2 · kind B2 · utility

Assignee

• ATMEL Germany GmbH · DE

Inventors

• Klaus Burger · Rutesheim, DE
• Dieter Mutz · Leingarten, DE
• Steffen Ziegler · Schopfheim, DE

Key dates

• Filing date: Oct 30, 2002
• Grant date: Oct 24, 2006
• Expiry date: Oct 30, 2022

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T83/148
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

In a method of opening of a housing of a plastic-housed electronic module by a laser, the electronic module is protected from the effects of the laser beam and the laser beam is stopped at a suitable time by providing an end point signal detection due to the laser beam impinging on a protective layer. Thereby, after opening the housing, electrical measurements can be carried out on the electronic module.