Encapsulated electronic sensor package
US7126063B2 · kind B2 · utility
0Cited by
14References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2003 |
| Grant date | Oct 24, 2006 |
| Priority date | — |
| Expiry date | Aug 4, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/0204
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic package includes a circuit board and a capsule layer encasing the circuit board and forming an immersible electronic module. A housing receives the electronic module and forms a protective shell around the electronic module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.