Light emitting device assembly
US7126165B2 · kind B2 · utility
1Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2004 |
| Grant date | Oct 24, 2006 |
| Priority date | — |
| Expiry date | Sep 13, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Provided is a light emitting device assembly. The light emitting device assembly includes a submount including bumps, each having a bonded surface and a lateral surface surrounding the bonded surface; and a light emitting device including pads, each having a bonded surface corresponding to a bonded surface of a corresponding bump. Herein, edges of the bonded surface of each of the bumps are spaced a predetermined distance inward from edges of a corresponding pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.