Vertical probe card and air cooled probe head system
US7126361B1 · kind B1 · utility
17Cited by
4References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2005 |
| Grant date | Oct 24, 2006 |
| Priority date | — |
| Expiry date | Aug 3, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/06727
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probe card is vertically mounted generally perpendicular to a wafer undergoing life tests in a heated environment to limit exposure of the probe card to heat from the wafer chuck. The probe card and probe head assembly are mounted on a support rail which has one or more channels for the flow of cool air to a probe head assembly and the probe card, while it shields the flex cable from the hot chuck. The cool air flow disrupts convective hot air flow upwards from the heated chuck to the probe card and probe head and facilitates cooling of the probe card and probe head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.