Hybrid-integrated high-speed OTDM module
US7127174B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2001 |
| Grant date | Oct 24, 2006 |
| Priority date | — |
| Expiry date | Sep 21, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04J14/08
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A novel optical time division multiplexing (OTDM) module based on hybrid-integrated optical chips is disclosed. An integrated modulator chip generates optical RZ signal streams which are then interleaved in an integrated time-delay chip to produce an OTDM signal. The integrated modulator chip is coupled and secured to the integrated time-delay chip via a suitable optical index-matching layer or collimating lenses. Such an approach alleviates the stability problems offered by conventional fiber-based OTDM technology and aids in reducing the size and complexity as well as lowering the cost for the assembly. Furthermore, the time-delay chip of the present invention offers fine tuning capabilities thereby allowing for slight adjustments in the interleaving of optical signal streams when non-standard data transmission rates are required.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.