Method for shaping pole pieces of magnetic heads by chemical mechanical polishing
US7127801B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2005 |
| Grant date | Oct 31, 2006 |
| Priority date | — |
| Expiry date | Mar 24, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49052
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thin film magnetic head that includes an improved P2 pole tip/yoke interface. The process for forming the P2 pole tip/yoke interface includes a CMP polishing step that is performed on the surface of the wafer subsequent to the plating of the P2 pole tip. This CMP step utilizes a relatively soft polishing pad and an acidic polishing slurry which preferentially attacks the P2 pole tip material, such that the CMP step results in the recession of the upper surface of the P2 pole tip relative to the dielectric layer surrounding it, as well as the significant rounding of the upper edges of the dielectric trench in which the P2 pole tip is formed. Thereafter, when the yoke is plated onto the P2 pole tip the rounded upper edges of the dielectric trench result in a concave curved interface between the yoke and the P2 pole tip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.