Method of forming one or more base structures on an LTCC cofired module
US7127809B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2004 |
| Grant date | Oct 31, 2006 |
| Priority date | — |
| Expiry date | Jan 4, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An LTCC module includes a base on one or more surfaces for receiving one or more external components to be attached to the module. A base is formed of a plurality of layers of metallization in a predetermined pattern. The layers include an adhesion layer on the LTCC module surface, with one or more intermediate layers, followed by a top layer. The module is fired with each application of the layers at a reduced temperature lower than the normal cofiring temperature of the LTCC module, but of sufficient value to partially sinter the layers. After the last applied top layer, the module is fired once at an elevated temperature to fully sinter the layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.