Heat sinks
US7128140B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2004 |
| Grant date | Oct 31, 2006 |
| Priority date | — |
| Expiry date | Oct 8, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat sink (100) includes a cooling block (105) having a plurality of fins (110) extending through the block to provide a series of coolant channels (112) extending between the fins, the channels having in the interior of the block a venturi narrowing. Beneficially, the channels have coolant entry regions in at least two different regions (115, 120) of the block to direct a plurality of coolant flows into the interior of the block from different directions.Also described is a method of cooling a device such as a processor of a mobile computer used in a vehicle by placing the heat sink or more than one of the heat sinks adjacent to the device to be cooled, preferably with a region in which the venturi narrowing of the coolant channels is provided close to the hottest part of the device to be cooled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.