Method and apparatus for sealing flex circuits having heat sensitive circuit elements
US7128801B2 · kind B2 · utility
2Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2005 |
| Grant date | Oct 31, 2006 |
| Priority date | — |
| Expiry date | Mar 19, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/304
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and apparatus is disclosed for affixing a cover layer formed of liquid crystal polymer to a flex circuit consisting of circuit elements mounted to a liquid crystal polymer substrate in order to encapsulate the circuit elements between the cover layer and substrate to protect them from exposure to moisture and contaminants and to provide thermal protection of temperature sensitive circuit elements within the flex circuit during the encapsulation process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.