Method for structuring an oxide layer applied to a substrate material
US7129109B2 · kind B2 · utility
17Cited by
24References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2002 |
| Grant date | Oct 31, 2006 |
| Priority date | — |
| Expiry date | Feb 28, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method for structuring an oxide layer applied to a substrate material. The aim of he invention is to provide an inexpensive method for structuring such an oxide layer. To this end, a squeegee paste that contains an oxide-etching component is printed on the oxide layer through a pattern stencil after silk screen printing and the printed squeegee paste is removed after a determined dwelling time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.