Wire-bondable image sensor having integral contaminant shadowing reduction structure
US7129459B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2004 |
| Grant date | Oct 31, 2006 |
| Priority date | — |
| Expiry date | Jan 17, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/024
Abstract
A wire-bondable image sensor having an integral contaminant shadowing reduction structure is described. In one aspect, an image sensor includes a substrate that has a side supporting at least one imaging area and at least one wirebonding area. Light detectors are constructed and arranged to receive light through the imaging area. Bond pads are exposed in the wirebonding area for connecting to respective bond wires. A contaminant shadowing reduction structure on the imaging area has an exposed contaminant displacement surface over the imaging area and separated from the imaging area by a distance of at least 300 μm. The contaminant shadowing reduction structure is substantially transparent to radiation within an operative wavelength range specified for the image sensor. Methods of making the above-mentioned image sensor also are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.