Methods of improving reliability of an electro-optical module
US7129722B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2002 |
| Grant date | Oct 31, 2006 |
| Priority date | — |
| Expiry date | May 20, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/309
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The quality and reliability of electro-optical modules can be improved, for instance, through improved testing and burn-in of an electro-optical sub-assembly. Reliability can also be enhanced through better methods of constructing an electro-optical module. By arranging both an electrical interface and an optical interface on a sub-assembly, for instance, testing can be performed on both interfaces in a single testing process. Burning-in an electro-optical sub-assembly can also improve the reliability of the module by identifying defects. A method of forming an electro-optical module can provide improved reliability by testing and/or burning-in an electro-optical sub-assembly before assembling the module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.