Dynamic overdrive compensation test system and method
US7129733B2 · kind B2 · utility
4Cited by
6References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2003 |
| Grant date | Oct 31, 2006 |
| Priority date | — |
| Expiry date | Jun 26, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2891
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention(s) relates to a wafer test system including a circuit to communicate an overdrive to a chuck, the chuck moving a wafer towards a probe head responsive to the overdrive, a circuit to measure a contact resistance of at least one channel in each of a plurality of dies associated with the wafer using the probe head, a circuit to compute a per channel standard deviation responsive to measuring the contact resistance, a circuit to compare the standard deviation on the at least one channel to a threshold, and a circuit to increase the overdrive responsive to the comparison.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.