Encapsulated surface acoustic wave sensor
US7129828B2 · kind B2 · utility
9Cited by
19References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 20, 2004 |
| Grant date | Oct 31, 2006 |
| Priority date | — |
| Expiry date | Dec 16, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L9/0025
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Sensor package systems and methods are disclosed, which include a quartz sensor package encapsulated by an overmold material. A surface acoustic wave sensing element and one or more bonding pads can be integrated with the quartz sensor package. Additionally, one or more antennas can be respectively bonded to the quartz sensor package at the bonding pads, such that the antennas communicates electrically with the surface acoustic wave sensing element and permits wireless interrogation of the quartz sensor package including the surface acoustic wave sensing element from an external wireless source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.