Heat dissipating device
US7130192B2 · kind B2 · utility
17Cited by
1References
17Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Apr 27, 2004 |
| Grant date | Oct 31, 2006 |
| Priority date | — |
| Expiry date | Oct 16, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipating device is adapted to remove heat from an electronic package. The heat dissipating device includes a heat sink (10) and a fan (30) generating airflow. The heat sink has a base (11) and a plurality of first fins (13) extending therefrom. First airflow channels (132) are defined between the first fins. A plurality of second fins (15) are transversely attached to the first fins. The second fins have second airflow channels (152) defined therebetween. The second airflow channels communicate with the first airflow channels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.