System of path planning for robotic manipulators based on maximum acceleration and finite jerk constraints
US7130716B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2004 |
| Grant date | Oct 31, 2006 |
| Priority date | — |
| Expiry date | Apr 22, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/45031
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A system for wafer handling employing a complex numerical method for calculating a path of wafer travel that controls wafer acceleration and jerk, and results in maximum safe speed of wafer movement from a first point to a second point. Motion is begun along a straight line segment while accelerating to a first path velocity. During this acceleration, the system computer calculates a series of straight line segments and interconnecting sinusiodally shaped paths over which the wafer is to be guided to the second point. The straight line segments and sinusiodally shaped paths are calculated so as to minimize total path length and the time required to move the wafer from the first point to the second point. The system computes the point of entrance and exit to and from each straight and sinusoidal path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.