Method of manufacturing printed circuit boards using miniature contact block packagings
US7131192B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 5, 2004 |
| Grant date | Nov 7, 2006 |
| Priority date | — |
| Expiry date | Jan 31, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This invention is a method of manufacturing printed circuit boards using a contact block packaging to provide and support electrical contact blocks relative to a printed circuit board panel. The contact block packaging is situated adjacent to the printed circuit board panel, so that electrical contact blocks of the contact block packaging are aligned with circuit boards of the printed circuit board panel, but breakaway stems supporting the electrical contact blocks are offset from webbing of the printed circuit board panel. The electrical contact blocks are then soldered to the printed circuit boards. Thereafter, the breakaway stems of the contact block packaging and the webs of the printed circuit board panel are broken, so that the electronic contact blocks are decoupled from the rest of the contact block packaging and the printed circuit boards are decoupled from the rest of the printed circuit board panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.