Material for diamond sintered body die and diamond sintered body die
US7131314B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 23, 2003 |
| Grant date | Nov 7, 2006 |
| Priority date | — |
| Expiry date | May 23, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB21C3/18
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
To provide a diamond compact die semi-manufactured product and a diamond compact die that do not crack during die processing.A diamond compact die semi-manufactured product includes a diamond compact and a holding ring. The holding ring is a cylinder composed of a tungsten alloy, and the inner diameter thereof is tapered. The diamond compact is tapered so as to fit to the taper of the cylinder and the diamond compact is press-fitted to the holding ring. For lower cost production, the tapered face of the diamond compact is formed by electric spark machining. The tungsten alloy contains 90% to 97% by weight of tungsten and 3% to 10% by weight of nickel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.