EB pattern profile printing
US7131380B2 · kind B2 · utility
13Cited by
70References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 7, 2001 |
| Grant date | Nov 7, 2006 |
| Priority date | — |
| Expiry date | Oct 1, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The present invention provides a printing process and a printed product in which a coating is combined with an additive that lowers the surface tension of the dried coating. The coating pattern is printed on a substrate, and is cured using electron beam (“EB”) processing. An ink is printed on top of the dried coating pattern. The ink flows away from the coating due to the difference in surface tension, forming a pattern of raised ink between the pattern and the coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.