Modular architecture for thermal control in a spacecraft
US7131484B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2003 |
| Grant date | Nov 7, 2006 |
| Priority date | — |
| Expiry date | Oct 2, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB64G1/503
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
Equipment (20, 20a) includes at least one electronic module (21) for the payload or the platform of a satellite (50) adapted to be supported by a structure (24) of the satellite, the satellite structure including a heat transfer system (44,10) for transporting dissipated heat to a radiator (51). The equipment includes at least transfer devices (22, 30, 31, 34, 341–345) for transferring heat dissipated by the electronic module and connectors (28, 34, 35, 37) for connecting the transfer devices to the heat transfer system (10) of the structure in such a manner as to enable the supply of heat exchange fluid (16) to the transfer devices and the transfer of heat dissipated by the electronic module to the radiator. A satellite structure includes an arrangement of equipments and a communication system for satellites, with particular application to the new generation of satellites with electrical propulsion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.