Resin curable with actinic radiation, process for the production thereof, and photocurable and thermosetting resin composition
US7132168B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 14, 2004 |
| Grant date | Nov 7, 2006 |
| Priority date | — |
| Expiry date | Dec 14, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31855
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A printed circuit board that includes a solder resist has a photocurable and thermosetting resin composition which comprises (A) an actinic energy ray-curable resin having at least one structure represented by the following general formula (1), (B) a polymerization initiator, (C) a diluent, and (D) a polyfunctional oxetane compound. The actinic energy ray-curable resin mentioned above can be produced by causing the reaction of (a) a polyfunctional oxetane compound with (b) an unsaturated monocarboxylic acid and the subsequent reaction of (c) a polybasic acid anhydride with a primary hydroxyl group of the resultant modified oxetane resin (a′).wherein R1 represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms, R2, R3 and R4 independently represent a hydrogen atom, an alkyl group of 1 to 6 carbon atoms, an aryl group, an aralkyl group, a cyano group, a fluorine atom, or a furyl group, and X represents a polybasic acid anhydride residue.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.