Positive photosensitive resin compositions
US7132205B2 · kind B2 · utility
11Cited by
3References
43Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 3, 2004 |
| Grant date | Nov 7, 2006 |
| Priority date | — |
| Expiry date | Jun 3, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/107
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An end-capped polybenzoxazole precursor having acid labile functional groups, positive working photosensitive compositions thereof and use of the compositions for producing heat resistant relief images on substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.