Diamond heat spreading and cooling technique for integrated circuits
US7132313B2 · kind B2 · utility
64Cited by
18References
20Claims
0Family size
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Key dates
| Filing date | Nov 25, 2003 |
| Grant date | Nov 7, 2006 |
| Priority date | — |
| Expiry date | Feb 21, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/93
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip is shown containing an integral heat spreading layer that more effectively transmits heat from the die to ambient as a result of spreading the heat out on the die over a larger cross sectional area. Local hot spots are minimized which allows the semiconductor chip to operate at a higher frequency for a given upper threshold temperature. Also shown is a method of manufacturing such a semiconductor chip, and the associated method of cooling a semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.