Method for shielding printed circuit board circuits
US7132357B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2005 |
| Grant date | Nov 7, 2006 |
| Priority date | — |
| Expiry date | Sep 29, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for shielding one or more circuits (21, 21′) of a printed circuit board includes depositing a layer of dielectric material (43) over a printed circuit board substrate (22) and the printed circuits (21, 21′), creating a trench-like opening (44) in the dielectric layer (43) such that the trench-like opening (44) surrounds the one or more circuits (21, 21′) to be shielded, depositing a layer of metal (27) over the layer of dielectric material (43) and within the trench-like openings (44), creating a solder pad (24) at each location where an electrical connection is to be made to the printed circuits (21, 21′) by removing a border of the metal layer (27) surrounding each connection location, and providing a microvia (25) through each solder pad (24) penetrating the dielectric layer (43) and terminating at the metal of the printed circuit (21, 21′).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.