System for and method of forming via holes by multiple deposition events in a continuous inline shadow mask deposition process
US7132361B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2004 |
| Grant date | Nov 7, 2006 |
| Priority date | — |
| Expiry date | Jan 25, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/945
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Via holes are formed in a continuous inline shadow mask production system by depositing a first conductor layer and subsequently depositing a first insulator layer over a portion of the first conductor layer. The first insulator layer is deposited in a manner to define at least one notch along its edge. The second insulator layer is then deposited on another portion of the first conductor layer in a manner whereupon the second insulator layer slightly overlaps each notch of the first insulator layer, thereby forming the one or more via holes. A conductive filler can optionally be deposited in each via hole. Lastly, a second conductive layer can be deposited over the first insulator layer, the second insulator layer and, if provided, the conductive filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.