Circuit board
US7132599B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 9, 2004 |
| Grant date | Nov 7, 2006 |
| Priority date | — |
| Expiry date | Sep 14, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4664
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board includes a printed circuit board layer, an insulating layer, and an electromagnetic interference sealed layer. The printed circuit board layer includes an insulating substrate on which circuit patterns are printed. The insulating layer covers the circuit patterns. The sealed layer covers the insulating layer and connected with a ground portion of the circuit patterns. The sealed layer that is formed by screen printing conductive paste has through holes. Edges are formed around the through holes other than the outer edges, and a total area of edges at which the thickness of the printed conductive paste is large due to surface tension increases. Thus, the sealed layer can be easily formed in a predetermined thickness, and stability in conductivity of the sealed layer can be maintained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.