Direct application voltage variable material, components thereof and devices employing same
US7132922B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2003 |
| Grant date | Nov 7, 2006 |
| Priority date | — |
| Expiry date | Jan 6, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0738
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A voltage variable material (“VVM”) including an insulative binder that is formulated to intrinsically adhere to conductive and non-conductive surfaces is provided. The binder and thus the VVM is self-curable and applicable in a spreadable form that dries before use. The binder eliminates the need to place the VVM in a separate device or to provide separate printed circuit board pads on which to electrically connect the VVM. The binder and thus the VVM can be directly applied to many different types of substrates, such as a rigid (FR-4) laminate, a polyimide or a polymer. The VVM can also be directly applied to different types of substrates that are placed inside a device. In one embodiment, the VVM includes doped semiconductive particles having a core, such which can be silicon, and an inert coating, which can be an oxide. The particles are mixed in the binder with conductive particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.