Power supply without cooling fan
US7133284B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 16, 2003 |
| Grant date | Nov 7, 2006 |
| Priority date | — |
| Expiry date | Jul 2, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/26
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The invention provides a power supply for a computer mainframe, which is cooled by a heat conduction method, and more particularly to a power supply without a cooling fan. The present invention features a highly effective heat pipe connecting a plurality of aluminum-extrusion heat sink fins and a plurality of aluminum-extrusion heat sinks, the aluminum-extrusion heat sink fins fixed above a cooling chip over a circuit board, and the aluminum-extrusion heat sinks fringed near the power supply, with a part of the heat sink fins exposed to the power supply. The heat of a chip is conducted out of the power supply by the aluminum-extrusion heat sink fins, the high-effect heat pipe, and the aluminum-extrusion heat sinks. Therefore, the power supply can reach an expected cooling effect without the cooling fan.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.