Cutting segment, method of manufacturing cutting segment, and cutting tool
US7134430B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 9, 2004 |
| Grant date | Nov 14, 2006 |
| Priority date | — |
| Expiry date | Dec 9, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28D1/121
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A cutting segment for a cutting tool used for cutting or drilling a brittle workpiece, such as stone, brick, concrete and asphalt, a method of manufacturing the segment and a cutting tool provided with the segment are disclosed. The segment comprises a plurality of plate-shaped metal matrix layers laminated perpendicular to a cutting surface of the segment while being parallel to a cutting direction of the segment, the plate-shaped metal matrix layers being integrally combined with each other and made of a ferrous or non-ferrous material; and diamond particle layers arranged between the plate-shaped metal matrix layers such that diamond particles can be provided in an array on the cutting surface. The segment has an excellent cutting capability, and can be made by a simplified manufacturing process, thereby remarkably reducing manufacturing costs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.