FPD encapsulation apparatus and method for encapsulating the same
US7135090B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2003 |
| Grant date | Nov 14, 2006 |
| Priority date | — |
| Expiry date | Sep 14, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2457/206
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An FPD encapsulation apparatus at least comprises a chamber and a pressing mechanism. In this case, the chamber has an airtight space to provide a low-pressure environment, and the low-pressure environment is located inside the airtight space. The pressing mechanism is disposed within the chamber, and the pressing mechanism is operated in the low-pressure environment for pressing a second substrate to bind a first substrate and the second substrate. Furthermore, a method for encapsulating an FPD is disclosed. The method comprises providing a first substrate, forming an adhesive on the first substrate, providing a second substrate to align the first substrate and face to the adhesive, providing a low-pressure environment for the first and second substrates, and binding the first and second substrates to form the FPD.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.