Process for making an organic electronic device having a roughened surface heat sink
US7135357B2 · kind B2 · utility
5Cited by
13References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2003 |
| Grant date | Nov 14, 2006 |
| Priority date | — |
| Expiry date | Oct 10, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/858
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An aspect of the present invention provides an organic electronic device includes a heat sink having a side with a roughened surface and/or a black surface and a process for forming devices having such heat sinks including forming a patterned electrically conductive layer includes an electrically conductive member. The process includes selectively forming spaced-apart members. The heat sink includes the spaced-apart members, which are spaced apart from each other and thermally coupled to the electrically conductive member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.