Method to form an interconnect
US7135405B2 · kind B2 · utility
8Cited by
10References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2004 |
| Grant date | Nov 14, 2006 |
| Priority date | — |
| Expiry date | Aug 4, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/773
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of methods, apparatuses, devices, and/or systems for forming an interconnect are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.