Electret assembly for a microphone having a backplate with improved charge stability
US7136496B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2002 |
| Grant date | Nov 14, 2006 |
| Priority date | — |
| Expiry date | Nov 28, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a microphone that includes a housing and a diaphragm and backplate located with the housing. The housing has a sound port for receiving the sound. The diaphragm undergoes movement relative to the backplate, which it opposes, in response to the incoming sound. The backplate has a charged layer with a first surface that is exposed to the diaphragm and a second surface opposite the first surface. The backplate further includes a conductor for transmitting a signal from the backplate to electronics in the housing. The conductor faces the second surface of the charged layer. To minimize the charge degradation created by contact with or infiltration of foreign materials, the first surface, the second surface, or both surfaces of the charged layer includes a protective layer thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.