Stamp having an antisticking layer and a method of forming of repairing such a stamp
US7137336B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 4, 2002 |
| Grant date | Nov 21, 2006 |
| Priority date | — |
| Expiry date | Aug 22, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0002
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A stamp for use in transferring a pattern in nano-scale has a monomolecular antisticking layer. The anti-sticking layer comprises molecular chains, which are covalently bound to the surface of the stamp and which each comprise at least one fluorine-containing group. Each molecular chain contains a group Q, which comprises a bond which is weaker than the other bonds in the molecular chain as well as the covalent bond that binds the molecular chain to the surface of the stamp. Splitting of said bond in the group Q creates a group Q1, which is attached to the part of the molecular chain being left on the surface of the stamp and which is capable of reacting with a fluorine-containing compound to restore the antisticking layer. In a method of manufacturing a stamp for use in transferring a pattern in nanoscale, the stamp is provided with the above-mentioned molecular chain. In a method of repairing a damaged antisticking layer of the above-mentioned stamp, the stamp is treated with a repairing reagent, which has a coupling end, which is capable of reacting with the group Q1, and a fluorine-containing group located at the other end of the repairing reagent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.