Apparatus and method for fabricating bonded substrate
US7137427B2 · kind B2 · utility
2Cited by
9References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2003 |
| Grant date | Nov 21, 2006 |
| Priority date | — |
| Expiry date | Nov 27, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1744
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed is a bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.