Method for making IC card
US7137563B2 · kind B2 · utility
11Cited by
5References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2004 |
| Grant date | Nov 21, 2006 |
| Priority date | — |
| Expiry date | Mar 30, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K19/07769
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for making a combination IC card comprising the steps of forming antenna leads and patterned connection leads, forming a hole for mounting an external electrode chip on a sheath on at least one side of the antenna substrate, mounting an IC chip on the antenna substrate having the antenna leads and the patterned connection leads, mounting the external electrode chip on the antenna substrate having the antenna leads and the patterned connection leads, and attaching the sheath having the hole on the antenna substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.