Patent · US Expired

Method and device for cutting single crystals, in addition to an adjusting device and a test method for determining a crystal orientation

US7137865B2 · kind B2 · utility

9Cited by

13References

9Claims

0Family size

Assignee

FREIBERGER COMPOUND MATERIALS GMBH · DE

Inventors

Ralf Hammer · Freiberg, DE
André Kleinwechter · Freiberg, DE
Tilo Flade · Freiberg, DE
Cornelia Kumann · Bredstedt, DE
Ralf Gruszynsky · Brand-Erbisdorf, DE

Key dates

Filing date	Jul 30, 2001
Grant date	Nov 21, 2006
Priority date	—
Expiry date	Jan 23, 2022

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S125/901
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

A method for the division of single crystals, in particular of GaAs, is provided in which a single crystal (1) to be cut into at least two parts and a cutting tool (2, 3; 8, 8a, 8b, 8c) are moved relative to one another in a direction of advancement (V) and wherein the single crystal (1) is oriented in such a way that a specified crystallographic orientation (K) lies in the cutting plane (T), characterized in that an angle (ρ) between the specified crystallographic direction (K) and the direction of advancement (V) is chosen in such a way that forces which act on the cutting tool during cutting in a direction at right angles to the cutting plane compensate one another.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.