Thickness control method and double side polisher
US7137867B2 · kind B2 · utility
7Cited by
9References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2006 |
| Grant date | Nov 21, 2006 |
| Priority date | — |
| Expiry date | Feb 23, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/105
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The object of the present invention is to provide a thickness control method for a double side polisher, accuracy of which is not affected by wearing of polishing pad and applicable to polishing of nonconductive work pieces. An eddy current sensor in a cavity of an upper polishing plate measures distance from the senor to the upper surface of carrier with holes for the work pieces being inserted respectively. The measured distance is successively monitored and polishing is stopped when the distance has become a predetermined value corresponding to target amount of material removal from the work piece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.