Thermal transfer sheet
US7138163B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2004 |
| Grant date | Nov 21, 2006 |
| Priority date | — |
| Expiry date | Dec 29, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41M5/44
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
There is provided a thermal transfer sheet which can surely prevent printing-derived cockling, fusing to a thermal head or the like caused by thermal head-derived thermal damage to a primer layer provided between a substrate sheet and a heat-resistant slip layer and, at the same time, can meet a demand for a reduction in thickness of the thermal transfer sheet and has a high level of suitability for high-speed printing. The thermal transfer sheet comprises: a substrate sheet; a colorant layer provided on one side of the substrate sheet; and a heat-resistant slip layer provided on the other side of the substrate sheet through a primer layer. The primer layer comprises a binder resin satisfying a G′a/G′b ratio value of not more than 100 wherein G′a represents the storage modulus of the binder resin at 80° C., Pa; and G′b represents the storage modulus of the binder resin at 140° C., Pa. For the binder resin satisfying the above relation expression of the modulus of elasticity, in the case of printing of an image in which a white image (a white part) and a black image (a black part) are present together, milder heat conditions are applied at the time of printing of the white part. In …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.