Electronic system for fixing power and signal semiconductor chips

US7138708B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Rainer Topp · Reutlingen, DE
• Dirk Balszunat · Stuttgart, DE
• Christoph Ruf · Eningen unter Achalm, DE
• Andreas Fischer · Entringen, DE

Key dates

• Filing date: Oct 15, 2002
• Grant date: Nov 21, 2006
• Expiry date: Oct 15, 2022

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An electronic system having a sandwich design and including two carriers, each carrier having a printed circuit layer, the upper printed circuit layer being positioned on different planes.