Circuit package integrating passive radio frequency structure
US7138884B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 2003 |
| Grant date | Nov 21, 2006 |
| Priority date | — |
| Expiry date | Oct 15, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P5/10
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
In general, the invention is directed to integration of passive radio frequency (RF) structures with at least one integrated circuit in a single integrated circuit (IC) package. An IC package in accordance with the invention may include, for example, a radio IC, a digital IC, a passive radio frequency balun as well as additional passive RF structures or ICs. Additionally, passive electronic components may further be incorporated in the IC package. For example, the IC package may include a resistor, capacitor, inductor or the like. The components of the IC package may be distributed throughout layers of a multi-layer IC package, such as a multi-layer ceramic package. The different ICs and the passive RF structures may be electrically coupled via conductive traces, which may be varied in thickness and length in order to match input and output impedances of the different ICs and passive RF structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.