Heat dissipation device
US7139171B2 · kind B2 · utility
4Cited by
16References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2004 |
| Grant date | Nov 21, 2006 |
| Priority date | — |
| Expiry date | Mar 16, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device includes a heat sink (50) and a fan (10) located above the heat sink for providing airflow. The heat sink includes a base (40) and a heat dissipating part (30) arranged on the base. The heat dissipating part includes a plurality of fins (31), each adjacent pair of the fins defines a channel (35) therebetween. The heat dissipating part defines a plurality of passages (34) disposed diagonally thereat and perpendicular to the channels. The channels and the passages are oriented consistently with the airflow of the fan.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.