Techniques for attaching a heat sink assembly to a circuit board component
US7139174B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2003 |
| Grant date | Nov 21, 2006 |
| Priority date | — |
| Expiry date | Aug 27, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit board module has a circuit board, a component mounted to the circuit board, and a heat sink assembly. The heat sink assembly includes a base member having a first edge and a second edge. The base member is configured to operate as a thermal conduit between a first location proximate to the component and a second location distal to the component. The heat sink assembly further includes a first rail member coupled to the base member along the first edge of the base member, a second rail member coupled to the base member along the second edge of the base member, and an actuation mechanism coupled to the base member. The actuation mechanism is configured to move portions of the members toward each other when the base member resides at the first location to fasten the base member to the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.