Process for the production of high-density printed wiring board
US7140103B2 · kind B2 · utility
3Cited by
5References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2002 |
| Grant date | Nov 28, 2006 |
| Priority date | — |
| Expiry date | Feb 28, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Process for producing a high-density printed wiring board, comprising:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.