Wire bonding method and apparatus
US7140529B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 17, 2005 |
| Grant date | Nov 28, 2006 |
| Priority date | — |
| Expiry date | Feb 17, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01033
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wire bonding apparatus that include a piezoelectric element 4 provided near the capillary attachment portion of a bonding arm 1 so that a capillary 3 vibrates in the axial direction of the bonding arm 1, the piezoelectric element 4 being driven by a piezoelectric element driving power source 11. The wire bonding apparatus further includes a detector 15 and a bonding arm control circuit 16, wherein the detector 15 detects the voltage or current generated by the piezoelectric element 4 when the capillary 3 is lowered and contacts the object of bonding, and the bonding arm control circuit 16 controls the lowering motion of the bonding arm 1 in accordance with the changes in the voltage or current detected by this detector 15.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.