Integrated high vacuum pumping system
US7140847B2 · kind B2 · utility
7Cited by
10References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2004 |
| Grant date | Nov 28, 2006 |
| Priority date | — |
| Expiry date | May 3, 2025 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF04D27/0269
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
The present invention relates to the integration of a TMP with the associated bypass line and valves so that a single sub-assembly is created. The housing of the TMP is significantly modified to accommodate the associated equipment necessary for constructing a high-vacuum system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.