High conductivity inks with low minimum curing temperatures
US7141185B2 · kind B2 · utility
3Cited by
29References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2003 |
| Grant date | Nov 28, 2006 |
| Priority date | — |
| Expiry date | Jan 29, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/095
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include additives which reduce the curing temperatures for use with low-temperature substrates. Conductive ink compositions can be deposited on a substrate coated with a cure temperature reducing agent to reduce the curing temperatures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.